纳米Al-CuO氧化石墨烯复合含能材料的制备与热化学性能研究

摘要：本文首先通过改进的Hummers法制备了氧化石墨烯（GO），所制备的GO片层上含有大量的含氧基团，DSC结果表明其在226.6℃发生含氧基团的分解放热反应。然后采用原位生长法在不同保温时间下制备了CuO/GO复合材料，SEM结果表明保温时间为1h时负载在GO片层上的CuO晶粒颗粒更大，粒径约为250nm。采用静电自组装法在不同分散剂条件下制备了Al-CuO/GO复合材料，XRD结果表明PEG-600的使用会使CuO在Al的负载过程中被还原为Cu2O和Cu。DSC结果表明：保温时间为1h，使用十二烷基磺酸钠制备的Al-CuO/GO复合材料铝热反应放热峰最为靠前，相较于纯Al-CuO铝热剂放热提前100℃以上；使用PEG-600制备的Al-CuO/GO复合材料铝热反应放热量比使用十二烷基磺酸钠有所减少。

关键词氧化石墨烯复合含能材料 Al CuO

毕业设计说明书外文摘要

Title Preparation and thermochemical properties of Al-CuO/graphene oxide nano-composite energetic materials

Abstract：In this paper, graphene oxide (GO) was prepared by modified Hummers method. The prepared GO layer contains a large amount of oxygen-containing groups. DSC results show that the exotherm of its oxygen-containing decomposition reaction occurred at 226.6 °C. Then CuO/GO composites were prepared by in situ growth method at different holding time. The results of SEM show that when the CuO/GO composites was prepared under the holding time of 1 h, the CuO nano-partical on the GO layer were larger, about 250nm. Al-CuO/GO composites were prepared by electrostatic self-assembly method under different dispersant conditions. The results of XRD show that CuO was reduced to Cu2O and Cu during the load process of Al. The results of DSC show that the the exothermic peak of the exothermic process for the Al-CuO/GO composite, which was prepared by sodium dodecyl sulfonate under the holding time of 1 h, occurred first of all, and ahead of time more than 100 ℃; the heat release for the thermite reaction of the Al-CuO/GO composite by using PEG-600 comparing with the sodium dodecyl sulfonate had a decrease.

Keywords GO composite energetic materials Al CuO

1 引言 2

1.1 氧化石墨（烯）概述 2

1.2 铝热剂概述 2

1.3 研究意义及研究内容 3

2 实验部分 5

2.1 GO的制备 5

2.2 CuO/GO复合材料的制备 6

2.3 Al-CuO/GO复合材料的制备 7

2.4 Al/GO复合材料的制备 8

2.5 Al-CuO复合材料的制备 9

3 实验结果与讨论 10

3.1 XRD表征 10

3.2 SEM表征 12

3.3 DSC表征 16

结论 21

致谢 22

参考文献 23

1 引言

1.1 氧化石墨（烯）概述

石墨烯是在2004年被英国曼彻斯特大学的物理学教授Geim［1］等发现的一种新型二维碳纳米材料，它是由碳原子以sp2杂化方式按照蜂巢晶格排列构成的单层二维晶体，其基本结构骨架非常稳定，大π共轭体系使石墨烯呈相对负电体系；并且其厚度只有0.335nm，是目前世界上最薄的材料。石墨烯同样是目前最坚固的材料（弹性模量为1060GPa），且理论比表面积高达2630m2·g-1，具有良好的导电性能（5000W·m-1·K-1），以及室温下高速的电子迁移率（2000000cm2·V-1·s-1）；加上石墨烯所具有的独特的电子结构和电学性质等掀起了科学界对其研究的热潮。到目前为止，就石墨烯的潜在应用进行了大量研究，研究发现，石墨烯的应用前景主要集中于电子器件、储氢材料、阻燃材料、电极材料、复合材料和微孔催化剂载体等方面，而在石墨烯这些众多的应用前景中，利用石墨烯制备功能复合材料最有可能在实际应用中取得突破［2］。纳米Al-CuO氧化石墨烯复合含能材料的制备与热化学性能研究:http://www.chuibin.com/huaxue/lunwen_206064.html